Company Filing History:
Years Active: 2010-2016
Title: Innovations by Chew Hwee-Seng Jimmy
Introduction
Chew Hwee-Seng Jimmy is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He has been granted 2 patents that showcase his innovative approaches in the field.
Latest Patents
One of his latest patents is titled "Method of manufacturing semiconductor element." This patent describes a method that includes several steps, such as providing a carrier and a mold, forming a first patterned conductive layer on the carrier, and infusing a mold cavity with a molding material. This process encapsulates the conductive layers while allowing for the traces to be exposed without affecting their width.
Another significant patent is "Semiconductor package for fine pitch miniaturization and manufacturing method thereof." This patent outlines a semiconductor package that features a first insulating layer with multiple holes for positioning solder balls. The design ensures that the signal from the semiconductor chip is effectively transmitted externally via the solder ball, enhancing the overall functionality of the package.
Career Highlights
Chew Hwee-Seng Jimmy is currently employed at Advanpack Solutions Pte Ltd., where he continues to innovate in semiconductor manufacturing. His work has significantly impacted the efficiency and effectiveness of semiconductor packaging.
Collaborations
He collaborates with talented coworkers, including Ong Chee Kian and Abd Razak Bin Chichik, who contribute to the innovative environment at Advanpack Solutions.
Conclusion
Chew Hwee-Seng Jimmy's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work continues to influence advancements in semiconductor manufacturing.