Abd Razak Bin Chichik

Title: Abd Razak Bin Chichik: Innovator in Semiconductor Manufacturing

Introduction

Abd Razak Bin Chichik is a notable inventor based in Singapore, recognized for his contributions to semiconductor manufacturing. With a total of 2 patents, he has made significant advancements in the field, particularly in methods that enhance the efficiency and effectiveness of semiconductor elements.

Latest Patents

His latest patents include a method of manufacturing a semiconductor element. This innovative method involves several steps, including the formation of a first patterned conductive layer on a carrier, followed by the creation of a second patterned conductive layer. The process culminates in the infusion of a molding material into a mold cavity, encapsulating the conductive layers while preserving the integrity of the traces.

Another significant patent is for a semiconductor package designed for fine pitch miniaturization. This package features a first insulating layer with multiple holes that serve as positioning settings for solder balls, ensuring effective connectivity between the semiconductor chip and the package traces. The design emphasizes the importance of material properties, with the elastic modulus of the insulating layer being greater than 1.0 GPa.

Career Highlights

Abd Razak is currently employed at Advanpack Solutions Pte Ltd., where he continues to innovate in semiconductor technology. His work has positioned him as a key player in the industry, contributing to advancements that are crucial for modern electronics.

Collaborations

He collaborates with talented coworkers, including Chew Hwee-Seng Jimmy and Ong Chee Kian, who share his commitment to pushing the boundaries of semiconductor technology.

Conclusion

Abd Razak Bin Chichik's contributions to semiconductor manufacturing reflect his dedication to innovation and excellence. His patents not only showcase his technical expertise but also highlight the importance of collaboration in driving technological advancements.