Company Filing History:
Years Active: 2004-2008
Title: Innovations in Semiconductor Packaging by Roman Perez
Introduction
Roman Perez is a prominent inventor based in Singapore, SG. With a remarkable portfolio of 4 patents, he has made significant contributions to the field of semiconductor packaging. His innovative designs focus on enhancing the efficiency and functionality of chip grid arrays, making him a valuable asset in the technology sector.
Latest Patents
Among his latest inventions, Roman has developed a groundbreaking package design and method of manufacture for chip grid arrays. This design features a semiconductor chip with molded pillars encapsulated in a robust material. The incorporation of solder balls that connect seamlessly to the chip pillars sets a new standard in packaging technology. Notably, this innovative package eliminates the need for a first-level substrate or interposer, allowing for straightforward assembly to the next level. Additionally, one variant of his patent includes an integrated thermal heat sink, enhancing the thermal management of the packaged chip.
Career Highlights
Roman Perez is currently associated with Advanpack Solutions Pte Ltd., where he continues to push the boundaries of semiconductor technology. His expertise and creativity in package design have earned him recognition within the industry, and his patents reflect his dedication to innovation. His work contributes significantly to advancing semiconductor manufacturing processes and improving product reliability.
Collaborations
Throughout his career, Roman has collaborated with talented colleagues such as Tan Kim Hwee and Kee Kwang Lau. These partnerships foster a dynamic environment for innovation, enabling the sharing of ideas and expertise critical for developing cutting-edge technologies in semiconductor packaging.
Conclusion
In conclusion, Roman Perez’s contributions to semiconductor packaging have led to notable advancements in the industry. With his innovative approach and dedication to improving technology, he continues to inspire fellow inventors and engineers. As he progresses in his career, his inventive spirit will undoubtedly lead to more groundbreaking solutions in the future.