The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
May. 12, 2005
Applicants:
Tan Kim Hwee, Singapore, SG;
Roman Perez, Singapore, SG;
Kee Kwang Lau, Singapore, SG;
Alex Chew, Singapore, SG;
Antonio Dimaano, Singapore, SG;
Inventors:
Tan Kim Hwee, Singapore, SG;
Roman Perez, Singapore, SG;
Kee Kwang Lau, Singapore, SG;
Alex Chew, Singapore, SG;
Antonio Dimaano, Singapore, SG;
Assignee:
Advanpack Solutions Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.