Company Filing History:

5 out of 44

Advanpack Solutions Pte Ltd.

patents

Years Active: 2003-2008

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7456496 - Package design and method of manufacture for chip grid array (2008-11-25),

2. 6929981 - Package design and method of manufacture for chip grid array (2005-08-16),

3. 6750082 - Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip (2004-06-15),

4. 6734039 - Semiconductor chip grid array package design and method of manufacture (2004-05-11),

5. 6510976 - Method for forming a flip chip semiconductor package (2003-01-28),

Title: Tan Kim Hwee - Pioneering Inventor from Singapore

Introduction: Tan Kim Hwee is a renowned inventor hailing from Singapore, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tan Kim Hwee holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Tan Kim Hwee has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Tan Kim Hwee has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Tan Kim Hwee's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology, inspiring the next generation of inventors to push the boundaries of what is possible.

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