Company Filing History:

4 out of 44

Advanpack Solutions Pte Ltd.

patents

Years Active: 2004-2014

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8766438 - Package structure (2014-07-01),

2. 7456496 - Package design and method of manufacture for chip grid array (2008-11-25),

3. 6929981 - Package design and method of manufacture for chip grid array (2005-08-16),

4. 6734039 - Semiconductor chip grid array package design and method of manufacture (2004-05-11),

Title: Inventor Kee Kwang Lau - Revolutionizing Technology in Singapore

Introduction: Kee Kwang Lau is a visionary inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kee Kwang Lau holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Kee Kwang Lau has worked with leading tech companies and research institutions to develop cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kee Kwang Lau has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Kee Kwang Lau's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.

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