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For the Inventor, By the Inventor

Singapore, Singapore

Kee Kwang Lau

This inventor holds 4 USPTO granted patents. Top assignee: Advanpack Solutions Pte Ltd.. Active years: 2004-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kee Kwang Lau. Retrieved from https://idiyas.com/inventor/kee-kwang-lau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 92(Granted Patents)


Company Filing History:

goldMedal4 out of 44 
 
Advanpack Solutions Pte Ltd.
 patents

Years Active: 2004-2014

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4 patents (USPTO):Explore Patents
1. 8766438 - Package structure (2014-07-01),
2. 7456496 - Package design and method of manufacture for chip grid array (2008-11-25),
3. 6929981 - Package design and method of manufacture for chip grid array (2005-08-16),
4. 6734039 - Semiconductor chip grid array package design and method of manufacture (2004-05-11),

Title: Inventor Kee Kwang Lau - Revolutionizing Technology in Singapore

Introduction: Kee Kwang Lau is a visionary inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kee Kwang Lau holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Kee Kwang Lau has worked with leading tech companies and research institutions to develop cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kee Kwang Lau has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Kee Kwang Lau's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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