The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Sep. 01, 2009
Hwee-seng Jimmy Chew, Singapore, SG;
Chee Kian Ong, Singapore, SG;
Kee Kwang Lau, Singapore, SG;
Advanpack Solutions PTE Ltd., Singapore, SG;
Abstract
The invention discloses a package structure including a semiconductor device, a first protection layer, a second protection layer and at least one conductive connector. The semiconductor device has at least one pad. The first protection layer is disposed on the semiconductor device and exposes the pad. The second protection layer, disposed on the first protection layer, has at least one first opening and at least one second opening. The first opening exposes a partial surface of the pad. The second opening exposes a partial surface of the first protection layer. The conductive connector, opposite to the pad, is disposed on the second protection layer and coupled to the pad through the first openings.