Advanpack Solutions Pte Ltd.

Flex-p Industries Sdn Bhd.

Colin Chun Sing Lum

Chee Kiang Yew

Tie Wang

Piau Fong

Matthew Keng Siew Chua

A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick&#x2122;, Secure Digital&#x2122; (SD) card, SmartMedia&#x2122; (SM) card, Multimedia card (MMC), CompactFlash&#x2122; (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) () to form the standard external dimensions and features of the memory card. The method comprises holding the populated PCB () in place in a cavity () of at least one mould piece; and moulding over both sides of the populated printed circuit board () to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB () in the moulding cavity () for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.

Method for packaging small size memory cards

In a no-flow underfill process , a substrate is heated to an elevated temperature prior to dispensing underfill thereon. The underfill flows more readily over mask portions and conductors on the substrate , filling in spaces between the conductors and the masking portions , thereby preventing air from being trapped thereabout. In addition, when a bumped die is heated during placement on the substrate with the underfill therebetween, the underfill flows around bumps more readily thereby preventing air from being trapped thereabout. The result is a flip chip semiconductor package having a lower void density.

Growing community of inventors

Singapore, Singapore

Colin Chun Sing Lum