The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Feb. 22, 2000
Kian Teng Eng, Singapore, SG;
Min Yu Chan, Singapore, SG;
Jing Sua Goh, Singapore, SG;
Siu Waf Low, Singapore, SG;
Boon Pew Chan, Singapore, SG;
Tuck Fook Toh, Singapore, SG;
Chee Kiang Yew, Singapore, SG;
Pak Hong Yee, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method and apparatus for producing an integrated circuit package ( ) comprising a substrate ( ) having an opening ( ) and first and second surfaces ( ), a plurality of routing strips ( ) being integral with the substrate ( ) and extending into the opening ( ), a plurality of pads ( ) disposed on the first and second surfaces ( ) are electrically connected with at least one of the routing strips ( ), wire bonding ( ) electrically connecting at least one bonding pad ( ) to at least one of the routing strips ( ) and a silicon chip ( ) attached to the printed circuit board ( ) by an adhesive material ( ) that provide a seal between silicon chip ( ) and printed circuit board ( ) is disclosed.