Company Filing History:

23 out of 38,002

Micron Technology Incorporated

patents

8 out of 29,279

Texas Instruments Corporation

patents

Years Active: 1994-2014

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31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8698295 - Super high-density module with integrated wafer level packages (2014-04-15),

2. 8304894 - Super high-density module with integrated wafer level packages (2012-11-06),

3. 8063493 - Semiconductor device assemblies and packages (2011-11-22),

4. 7884007 - Super high density module with integrated wafer level packages (2011-02-08),

5. 7633159 - Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages (2009-12-15),

6. 7579681 - Super high density module with integrated wafer level packages (2009-08-25),

7. 7553697 - Multiple chip semiconductor package (2009-06-30),

8. 7485562 - Method of making multichip wafer level packages and computing systems incorporating same (2009-02-03),

9. 7368374 - Super high density module with integrated wafer level packages (2008-05-06),

10. 7304375 - Castellation wafer level packaging of integrated circuit chips (2007-12-04),

11. 7274094 - Leadless packaging for image sensor devices (2007-09-25),

12. 7271027 - Castellation wafer level packaging of integrated circuit chips (2007-09-18),

13. 7208335 - Castellated chip-scale packages and methods for fabricating the same (2007-04-24),

14. 7193312 - Castellation wafer level packaging of integrated circuit chips (2007-03-20),

15. 7173330 - Multiple chip semiconductor package (2007-02-06),

Title: Siu Waf Low: A Pioneer in Semiconductor Innovations

Introduction

Siu Waf Low is an esteemed inventor based in Singapore, recognized for his impactful contributions to the field of semiconductor technology. With an impressive portfolio of 31 patents, Low continues to push the boundaries of innovation within the electronics industry.

Latest Patents

Among Low's latest achievements is the patent for a "Super high-density module with integrated wafer level packages." This innovative design encompasses a wafer level package and a semiconductor wafer, along with an electronic system and memory module that incorporate these advanced packages. The invention outlines methods for fabricating die packages on a wafer level and integrated circuit modules, enhancing the functionality and efficiency of electronic devices. In particular, the die package features a redistribution layer that interconnects multiple dies, which can include memory devices such as static random access memories (SRAMs). This design allows for incorporation into a variety of electronic systems, including single in-line memory modules (SIMMs) and dual in-line memory modules (DIMMs).

Career Highlights

Siu Waf Low's career includes key positions in prominent companies such as Micron Technology Incorporated and Texas Instruments Corporation. His experience in these organizations has significantly influenced his innovative work and patent contributions in semiconductor technologies.

Collaborations

Throughout his career, Low has collaborated with notable professionals in the field, including Yong Poo Chia and Suan Jeung Boon. These collaborations have further enriched his innovative endeavors and expanded his impact on semiconductor development.

Conclusion

Siu Waf Low exemplifies the spirit of innovation in the semiconductor industry. With his extensive array of patents and strategic collaborations, he continues to lead advancements in technology that shape the future of electronic systems. His work not only demonstrates his ingenuity but also serves as an inspiration to fellow inventors and engineers striving to make their mark in the world of innovation.

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