The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Aug. 28, 2002
Suan Jeung Boon, Jin Kayu, SG;
Yong Poo Chia, Singapore, SG;
Yong Loo Neo, Singapore, SG;
Swee Kwang Chua, Singapore, SG;
Siu Waf Low, Singapore, SG;
Suan Jeung Boon, Jin Kayu, SG;
Yong Poo Chia, Singapore, SG;
Yong Loo Neo, Singapore, SG;
Swee Kwang Chua, Singapore, SG;
Siu Waf Low, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity.