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Years Active: 2004-2014
Title: Innovations and Contributions of Yong Loo Neo in Semiconductor Technology
Introduction: Yong Loo Neo is a prominent inventor based in Singapore, recognized for his exceptional contributions to the field of semiconductor technology. With an impressive portfolio of 22 patents, he has made significant strides in innovative packaging techniques that have transformed the efficiency and functionality of electronic systems.
Latest Patents: Among his latest inventions, Yong Loo Neo has developed advanced technologies such as the "Super High-Density Module with Integrated Wafer Level Packages." This patent details a wafer level package, an electronic system, and a memory module incorporating these advanced packages. The integrated circuit modules consist of a die package that features a redistribution layer interconnecting multiple dies on a substrate, typically a semiconductor wafer. This innovative package allows memory devices, like static random-access memories (SRAMs), to be effectively integrated into various electronic systems, including single in-line memory modules (SIMMs) and dual in-line memory modules (DIMMs).
Another significant innovation involves a method for wafer level packaging through the formation of trenches creating through vias in the substrate. The technology enables efficient connectivity by filling these trenches with a conductor, establishing contact points on both sides of the substrate. Such advanced techniques ensure a reduction in space while enhancing the performance of electronic components.
Career Highlights: Yong Loo Neo has built his career in influential companies including Micron Technology Incorporated and Aptina Imaging Corporation. His experience at these organizations has provided him with a robust foundation in semiconductor research and development.
Collaborations: Throughout his career, Yong Loo has collaborated with notable colleagues such as Yong Poo Chia and Suan Jeung Boon. These partnerships have contributed to his innovative research, fostering a collaborative environment that drives technological advancement.
Conclusion: Yong Loo Neo's contributions to the field of semiconductor technology through his 22 patents underline his status as a leading inventor. His innovative approaches to wafer level packaging and memory modules have significantly impacted the electronic systems industry, paving the way for future advancements and efficiencies. As technology continues to evolve, Yong Loo Neo's work remains a cornerstone in the ongoing quest for innovation in semiconductor design and manufacturing.