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For the Inventor, By the Inventor

Singapore, Singapore

Yong Poo Chia

This inventor holds 58 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Micron Technology Incorporated, Aptina Imaging Corporation. Active years: 2004-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Poo Chia. Retrieved from https://idiyas.com/inventor/yong-poo-chia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 58 

% Patents Active = 87.9

 

Average Co-Inventor Count = 3.6

ph-index = 17

Forward Citations = 848(Granted Patents)

Forward Citations (Not Self Cited) = 787(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal56 out of 39,176 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 580 
 
Aptina Imaging Corporation
 patents
where one patent can have more than one assignee

Years Active: 2004-2024

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Areas of Expertise:
Through-Body Vias
Microelectronic Die Packages
Wafer Level Packaging
Semiconductor Assemblies
Leadframes
Stacked Die Packages
Integrated Circuits
Interconnects
High-Density Modules
Packaging Methods
Trench Intersects
Molding Material
58 patents (USPTO):Explore Patents
1. 12087738 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2024-09-10),
2. 11594525 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2023-02-28),
3. 11398457 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2022-07-26),
4. 10622308 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2020-04-14),
5. 10593653 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2020-03-17),
6. 10431531 - Semiconductor dies with recesses, associated leadframes, and associated systems and methods (2019-10-01),
7. 10396059 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2019-08-27),
8. 10074599 - Semiconductor dies with recesses, associated leadframes, and associated systems and methods (2018-09-11),
9. 10056359 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2018-08-21),
10. 9911696 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2018-03-06),
11. 9679834 - Semiconductor dies with recesses, associated leadframes, and associated systems and methods (2017-06-13),
12. 9653444 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2017-05-16),
13. 9418872 - Packaged microelectronic components (2016-08-16),
14. 9165910 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2015-10-20),
15. 9099571 - Packaged integrated circuit devices with through-body conductive vias, and methods of making same (2015-08-04),

Title: The Innovations of Yong Poo Chia in Integrated Circuit Technology

Introduction

Yong Poo Chia is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit technology. With a remarkable portfolio comprising 58 patents, he has established himself as a leading figure in the industry, consistently developing innovative solutions that enhance electronic devices.

Latest Patents

Among his latest inventions are groundbreaking patents focused on packaged integrated circuit devices equipped with through-body conductive vias. These inventions detail a device that includes at least one integrated circuit die, strategically positioned in a body of encapsulant material. The innovative design features conductive vias extending through the encapsulant, a significant advancement that optimizes performance and reliability in electronic applications.

Career Highlights

Yong Poo Chia has made substantial impacts through his work with notable companies such as Micron Technology Incorporated and Aptina Imaging Corporation. His expertise in developing advanced circuitry and packaging methods has contributed to the evolution of electronic devices, making them more efficient and effective for consumer and industrial use.

Collaborations

Throughout his career, Yong Poo Chia has collaborated with talented professionals, including Suan Jeung Boon and Meow Koon Eng. These partnerships have fostered an environment of innovation, leading to transformative developments in the field of integrated circuits.

Conclusion

The work of Yong Poo Chia exemplifies the spirit of innovation and the drive for advancements in technology. His extensive patent portfolio and collaborations underscore his influence in the industry, and his contributions continue to shape the future of integrated circuit design and functionality in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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