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For the Inventor, By the Inventor

Singapore, Singapore

Suan Jeung Boon

USPTO Granted Patents = 53 

 

Average Co-Inventor Count = 3.2

ph-index = 17

Forward Citations = 968(Granted Patents)

Forward Citations (Not Self Cited) = 903(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Jin Kayu, SG (2007)
  • Singapore, SG (2004 - 2020)

Company Filing History:

goldMedal53 out of 38,002 
 
Micron Technology Incorporated
 patents

Years Active: 2004-2020

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Areas of Expertise:
Packaged Semiconductor Assemblies
Microelectronic Die Packages
Wafer Level Packaging
Super High-Density Modules
Interconnects for Packaged Devices
Leadless Packaging
Multichip Wafer Level Packages
Image Sensor Devices
Conductive Via Formation
Stacked Die Packages
Semiconductor Device Assemblies
Castellation Packaging
53 patents (USPTO):Explore Patents
1. 10622308 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2020-04-14),
2. 10396059 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2019-08-27),
3. 10056359 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2018-08-21),
4. 9911696 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2018-03-06),
5. 9653444 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2017-05-16),
6. 9165910 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2015-10-20),
7. 8906744 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2014-12-09),
8. 8698295 - Super high-density module with integrated wafer level packages (2014-04-15),
9. 8564106 - Wafer level packaging (2013-10-22),
10. 8555495 - Method for packaging circuits (2013-10-15),
11. 8536702 - Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods (2013-09-17),
12. 8525320 - Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods (2013-09-03),
13. 8445330 - Interconnects for packaged semiconductor devices and methods for manufacturing such devices (2013-05-21),
14. 8362594 - Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material (2013-01-29),
15. 8304894 - Super high-density module with integrated wafer level packages (2012-11-06),

Suan Jeung Boon: Innovator in Semiconductor Technology

Introduction

Suan Jeung Boon is a notable inventor based in Singapore, SG, who has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 53 patents, his work has greatly influenced the advancements in microelectronic systems.

Latest Patents

Among his latest innovations are groundbreaking patents related to packaged semiconductor assemblies. One of these patents describes advanced packaged semiconductor assemblies, which include interconnect structures and detailed methods for their manufacturing. In this embodiment, a packaged semiconductor assembly features a support member with a first bond-site and a die equipped with a second bond-site. An interconnect structure connects the two bond-sites using a wire that couples at least one of them. Additionally, the interconnect structure contains a third bond-site linked to the wire, providing more versatility in microelectronic applications.

Another notable patent covers microelectronic die packages, particularly those involving stacked systems. This invention details a system where a first die package has a bottom side and metal leads, and a second die package is attached to it with aligned metal leads extending toward the first. The innovation includes metal solder connectors linking individual leads of both packages, further enhancing the efficiency of the die stack. Remarkably, some second leads have an 'L' shape or a 'C' shape, which enables them to make effective physical contact with corresponding leads, improving performance and reliability.

Career Highlights

Suan Jeung Boon is currently associated with Micron Technology Incorporated, a prominent player in the semiconductor industry. His role here has allowed him to push the boundaries of current technologies, enabling Micron to bolster its offerings in semiconductor solutions.

Collaborations

Throughout his career, Suan has collaborated with talented peers, including Yong Poo Chia and Meow Koon Eng. Their combined expertise has fostered an environment of innovation, resulting in novel solutions that address complex challenges in semiconductor engineering.

Conclusion

Suan Jeung Boon’s contributions to semiconductor technology through his patents and collaborations underline his significance as an inventor. His ongoing work at Micron Technology Incorporated and the development of advanced semiconductor assemblies and packages showcase the impact of his innovations in the electronic industry. With every new patent, Suan continues to shape the future of technology.

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