The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
Dec. 19, 1997
Applicant:
Inventors:
Chee Kiang Yew, Singapore, SG;
Kian Teng Eng, Singapore, SG;
Sian Yong Khoo, Singapore, SG;
Bok Leng Ser, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361760 ; 361748 ; 361790 ; 361750 ; 257685 ; 257686 ; 257777 ; 257723 ; 257724 ; 174250 ; 174260 ; 174262 ;
Abstract
A high density single inline memory module (140) comprising a printed circuit board (132) and at least one integrated circuit module (130) attached to the first side (134) of the printed circuit board (132), wherein the integrated circuit modules (130) each including first and second integrated circuit packages (30) stackably and electrically connected together is disclosed.
Yew, Chee. (1999). High density single inline memory module (U.S. Patent No. 5956233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5956233
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile