The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Jul. 07, 1998
Applicant:
Inventors:

Tito Gelsomini, Plano, TX (US);

Chee Kiang Yew, Singapore, SG;

Yong Khim Swee, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 ;
U.S. Cl.
CPC ...
H05K 1/11 ;
Abstract

A high density memory module is disclosed comprising a first packaged integrated circuit memory device having therein a first electrically insulating carrier and a first conductive routing pattern integral with said first carrier, and at least a first semiconductor circuit chip; a second packaged integrated circuit memory device electrically connected to said first device, wherein said first and second devices form a module; said second packaged integrated circuit device having therein a second electrically insulating carrier and second conductive routing pattern integral with said second carrier, and at least a second semiconductor circuit chip; and said second conductive routing pattern including means for modifying the architectural organization of said module.


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