The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Jun. 22, 2009
Yong Chuan Koh, Singapore, SG;
Jimmy Siat, Singapore, SG;
Jeffrey Nantes Salamat, Singapore, SG;
Lope Vallespin Pepito, Jr., Singapore, SG;
Ronaldo Cayetano Calderon, Singapore, SG;
Rodel Manalac, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Kian Teng Eng, Compass Heights, SG;
Yong Chuan Koh, Singapore, SG;
Jimmy Siat, Singapore, SG;
Jeffrey Nantes Salamat, Singapore, SG;
Lope Vallespin Pepito, Jr., Singapore, SG;
Ronaldo Cayetano Calderon, Singapore, SG;
Rodel Manalac, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Kian Teng Eng, Compass Heights, SG;
United Test and Assembly Center Ltd., Singapore, SG;
Abstract
A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.