Singapore, Singapore

Jeffrey Nantes Salamat


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovations by Jeffrey Nantes Salamat in Semiconductor Packaging

Introduction

Jeffrey Nantes Salamat is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and reliability of semiconductor devices.

Latest Patents

One of Jeffrey's key patents is titled "Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process." This patent describes a semiconductor package and a method for constructing the package. The package includes a substrate and a die attached to it. A first contact region is located on the substrate, while a second contact region is found on the die. The first contact region comprises copper coated with an OSP material. A copper wire bond electrically connects the first and second contact regions. The wire bonding process involves forming a ball bump on the first contact region, which has a flat top surface achieved through a smoothing process. A ball bond is then formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region. This innovative method improves the overall performance of semiconductor packages.

Career Highlights

Jeffrey Nantes Salamat is currently employed at United Test and Assembly Center Limited. His work at this company has allowed him to focus on advancing semiconductor technologies. His expertise in the field has made him a valuable asset to his team and the industry.

Collaborations

Throughout his career, Jeffrey has collaborated with talented individuals such as Yong Chuan Koh and Jimmy Siat. These collaborations have fostered innovation and contributed to the success of their projects.

Conclusion

Jeffrey Nantes Salamat's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry positively.

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