Company Filing History:
Years Active: 2012
Title: Jimmy Siat: Innovator in Semiconductor Packaging
Introduction
Jimmy Siat is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a focus on enhancing wire bonding processes, he has developed innovative solutions that improve the reliability and efficiency of electronic components. His work is particularly significant in the context of modern electronics, where miniaturization and performance are paramount.
Latest Patents
Jimmy Siat holds a patent for a groundbreaking invention titled "Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process." This patent describes a semiconductor package and a method for constructing the package, which includes a substrate and a die attached to it. The first contact region on the substrate comprises copper coated with an OSP material, while the second contact region is located on the die. A copper wire bond electrically connects these regions, with a unique wire bonding process that involves forming a ball bump on the first contact region, achieved through a smoothing process. This innovation enhances the reliability of wire bonding in semiconductor applications.
Career Highlights
Jimmy Siat is currently employed at United Test and Assembly Center Limited, where he applies his expertise in semiconductor technology. His role involves collaborating with a team of skilled professionals to advance the company's capabilities in testing and assembly processes. His contributions have been instrumental in driving innovation within the organization.
Collaborations
Throughout his career, Jimmy has worked alongside talented colleagues, including Yong Chuan Koh and Jeffrey Nantes Salamat. These collaborations have fostered a dynamic environment for innovation and have led to significant advancements in semiconductor packaging technologies.
Conclusion
Jimmy Siat's work in semiconductor packaging exemplifies the impact of innovative thinking in technology. His patent and contributions to United Test and Assembly Center Limited highlight his commitment to advancing the field. As technology continues to evolve, inventors like Jimmy play a crucial role in shaping the future of electronics.