United Test and Assembly Center Limited

Jimmy Siat

Kian Teng Eng

Pang Hup Ong

Rodel Manalac

Yong Chuan Koh

Jeffrey Nantes Salamat

Lope Vallespin Pepito, Jr

Ronaldo Cayetano Calderon

A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

Growing community of inventors

Singapore, Singapore

Jimmy Siat