Company Filing History:
Years Active: 2012
Title: Lope Vallespin Pepito, Jr: Innovator in Semiconductor Packaging
Introduction
Lope Vallespin Pepito, Jr. is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique patent that enhances the efficiency and reliability of semiconductor devices.
Latest Patents
Lope Vallespin Pepito, Jr. holds a patent for a "Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process." This patent describes a semiconductor package and a method for constructing the package. The package includes a substrate and a die attached to it. A first contact region is located on the substrate, while a second contact region is situated on the die. The first contact region comprises copper coated with an OSP material. A copper wire bond electrically connects the first and second contact regions. The wire bonding process involves forming a ball bump on the first contact region with a flat top surface, achieved through a smoothing process. A ball bond is then formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.
Career Highlights
Lope Vallespin Pepito, Jr. is currently employed at United Test and Assembly Center Limited. His work at this company has allowed him to apply his innovative ideas in practical settings, contributing to advancements in semiconductor technology.
Collaborations
Some of his coworkers include Yong Chuan Koh and Jimmy Siat. Their collaboration has likely fostered an environment of innovation and creativity within their projects.
Conclusion
Lope Vallespin Pepito, Jr. is a distinguished inventor whose work in semiconductor packaging has made a significant impact in the industry. His patent demonstrates his commitment to advancing technology and improving manufacturing processes.