Company Filing History:
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Years Active: 2006-2013
Title: Innovator Rodel Manalac: Pioneering Semiconductor Solutions in Singapore
Introduction: Rodel Manalac, an accomplished inventor based in Singapore, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Manalac has a track record of innovation in methods that enhance semiconductor package design and assembly processes.
Latest Patents: Among his latest patents, Manalac's inventions showcase cutting-edge techniques in semiconductor packaging. The first patent details a novel method for attaching semiconductor dies to substrates. This method involves placing a die on a solder mask on the substrate and mounting it by applying pressure and heat. The applied pressure ranges from approximately 5 to 10 kgf, while the heating temperature varies from about 150 to 200°C. This efficient process takes only 1 to 10 seconds to bond the die securely.
Another notable patent addresses a semiconductor package construction that involves a substrate with a die attached. This package features a first contact region made of copper coated with an organic solderability preservative (OSP), ensuring superior electrical performance. The innovative wire bonding process includes forming a ball bump with a flat top surface, which enhances the reliability and efficiency of the electrical connections.
Career Highlights: Rodel Manalac has built a reputable career in the semiconductor industry, working with esteemed companies such as the United Test and Assembly Center. His expertise and innovative approach have played a vital role in advancing semiconductor assembly processes, making him a valuable asset in his field.
Collaborations: Throughout his career, Manalac has collaborated with several talented professionals, including Kian Teng Eng and Pang Hup Ong. Their shared expertise and teamwork have contributed to the successful development of advanced semiconductor technologies.
Conclusion: Rodel Manalac stands out as an influential inventor in the semiconductor landscape of Singapore. His patents reflect his commitment to innovation and excellence, providing groundbreaking solutions that address critical challenges in semiconductor packaging. As technology continues to evolve, Manalac's contributions are sure to leave a lasting impact on the industry.