For the Inventor, By the Inventor

Enter assignee name

Singapore, Singapore

United Test and Assembly Test Center Ltd.

USPTO Granted Patents = 2

Forward Citations = 13

Loading Chart...

Loading Chart...

6 inventors (with patents filed for the assignee):

Hien Boon Tan (2 out of 18 patents)

Francis YongWee Poh (1 out of 7 patents)

Anthony Yi Sheng Sun (1 out of 13 patents)

4. Rodel Manalac (1 out of 3 patents)

5. Jaime Siat (1 out of 1 patent)

6. Roland Cordero (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 8129222 - High density chip scale leadframe package and method of manufacturing the package (2012-03-06),

2. 7109570 - Integrated circuit package with leadframe enhancement and method of manufacturing the same (2006-09-19),

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

2 Patents

#568 in Singapore

#569 in Singapore

Singapore, Singapore

United Test and Assembly Test Center Ltd.

Forward Citations = 13

6 inventors:

Hien Boon Tan (2 out of 18 patents)

Francis YongWee Poh (1 out of 7 patents)

Anthony Yi Sheng Sun (1 out of 13 patents)

4. Rodel Manalac (1 out of 3 patents)

5. Jaime Siat (1 out of 1 patent)

Please report any incorrect information to support@idiyas.com

Loading…