Company Filing History:
Years Active: 2006
Title: Spotlight on Inventor Jaime Siat
Introduction: Jaime Siat is a notable inventor based in Singapore, SG, recognized for his innovative contributions to the field of integrated circuit technology. With a keen focus on enhancing electronic packaging, he has demonstrated his expertise through his single patent that addresses a crucial aspect of integrated circuit design.
Latest Patents: Jaime holds a patent for an "Integrated Circuit Package with Leadframe Enhancement and Method of Manufacturing the Same." This invention outlines a sophisticated integrated circuit package featuring a die pad and a variety of leads. Notably, at least one of these leads incorporates a recess in its first face. The design includes an integrated circuit chip that is securely coupled to the die pad via an adhesive layer. Jaime's innovation utilizes multiple wires to connect the chip to the leads, while an encapsulant surrounds the chip, wires, die pad, and portions of the leads. The encapsulant displays downward and outward slanting side walls, with unique intersections defined by the recess in the lead, enhancing both functionality and manufacturability.
Career Highlights: Jaime Siat contributes his knowledge and skills at the United Test and Assembly Center Ltd., a leading firm specializing in semiconductor testing and packaging. His work at the company demonstrates a strong commitment to advancing the field of integrated circuits through innovative solutions.
Collaborations: Within the innovative environment of his workplace, Jaime collaborates with talented professionals, including fellow engineers Rodel Manalac and Hien Boon Tan. Their combined expertise enhances their innovations, driving the development of cutting-edge technologies within the semiconductor industry.
Conclusion: Jaime Siat exemplifies the spirit of innovation in Singapore's technological landscape. His patent for an integrated circuit package stands as a testament to his dedication to enhancing electronic design and manufacturing processes. As he continues to collaborate with skilled professionals, his contributions are likely to shape the future of integrated circuit technology.