Singapore, Singapore

Roland Cordero


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Innovator Profile: Roland Cordero

Introduction

Roland Cordero is an inventive mind based in Singapore, SG, known for his contributions to the field of integrated circuit technology. With a strong focus on enhancing electronic components, Cordero has secured one patent that showcases his innovative approach to circuit packaging.

Latest Patents

Cordero's notable patent is titled "Integrated circuit package with leadframe enhancement and method of manufacturing the same." This invention presents an integrated circuit package that features a die pad and multiple leads. Notably, at least one lead is designed with a recess on its first face, improving both the functionality and structure of the package. An integrated circuit chip is affixed to the die pad using an adhesive layer, and a series of wires connect the first face of the chip to the various leads. The entire assembly is enclosed within an encapsulant that not only protects the components but also forms slanting side walls, enhancing the overall design and efficiency of the circuit package.

Career Highlights

Currently, Cordero is employed at United Test and Assembly Center Ltd., a prominent company in the semiconductor industry. His role involves the integration of advanced technologies in circuit assembly, where his expertise in patentable innovations plays a crucial part in the company's advancements.

Collaborations

Throughout his career, Cordero has collaborated with esteemed colleagues such as Rodel Manalac and Hien Boon Tan. Together, they contribute to various projects that push the boundaries of semiconductor technology, fostering an environment of innovation and creativity within their team.

Conclusion

Roland Cordero exemplifies the spirit of innovation in the field of electronics. His patent on integrated circuit packaging not only demonstrates his technical proficiency but also reflects his commitment to pushing technological boundaries. As he continues to work at United Test and Assembly Center Ltd., there is no doubt that his contributions will pave the way for future advancements in the industry.

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