The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Oct. 20, 2011
Denver Paul C. Castillo, Singapore, SG;
Bryan Soon Hua Tan, Singapore, SG;
Rodel Manalac, Singapore, SG;
Kian Teng Eng, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Soo Pin Chow, Singapore, SG;
Wolfgang Johannes Hetzel, Nattheim, DE;
Werner Josef Reiss, Bad Feilnbach, DE;
Florian Ammer, Ergoldsbach, DE;
Denver Paul C. Castillo, Singapore, SG;
Bryan Soon Hua Tan, Singapore, SG;
Rodel Manalac, Singapore, SG;
Kian Teng Eng, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Soo Pin Chow, Singapore, SG;
Wolfgang Johannes Hetzel, Nattheim, DE;
Werner Josef Reiss, Bad Feilnbach, DE;
Florian Ammer, Ergoldsbach, DE;
United Test and Assembly Center, Ltd., Singapore, SG;
QIMONDA AG, , DE;
Abstract
A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.