Florian Ammer

Title: Florian Ammer: Innovator in Semiconductor Packaging

Introduction

Florian Ammer is a notable inventor based in Ergoldsbach, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the area of semiconductor packaging.

Latest Patents

Florian Ammer holds a patent for a semiconductor package and method of attaching semiconductor dies to substrates. This innovative method involves mounting a semiconductor die on a substrate with a solder mask on a first surface. The process includes placing a die on the solder mask and mounting it to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, while the heat is maintained at a temperature range from approximately 150 to 200°C. The pressure is applied for a duration of approximately 1 to 10 seconds.

Career Highlights

Throughout his career, Florian has worked with prominent companies in the semiconductor industry. He has been associated with United Test and Assembly Center Limited and Qimonda AG, where he contributed to various projects and advancements in semiconductor technology.

Collaborations

Florian has collaborated with several professionals in his field, including Denver Paul C Castillo and Bryan Soon Hua Tan. These collaborations have further enriched his experience and expertise in semiconductor packaging.

Conclusion

Florian Ammer's innovative work in semiconductor packaging has made a significant impact on the industry. His patent and career achievements reflect his dedication to advancing technology in this critical field.