Yong Chuan Koh

Title: Yong Chuan Koh: Innovator in Semiconductor Packaging

Introduction

Yong Chuan Koh is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a focus on enhancing wire bonding processes, his work has significant implications for the electronics industry. He holds a patent that showcases his innovative approach to improving semiconductor packages.

Latest Patents

Yong Chuan Koh is credited with a patent titled "Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process." This patent describes a semiconductor package and a method for constructing it. The package includes a substrate and a die attached to it. A first contact region is located on the substrate, while a second contact region is found on the die. The first contact region comprises copper coated with an OSP material. A copper wire bond electrically connects the first and second contact regions. The wire bonding process involves forming a ball bump on the first contact region, which has a flat top surface achieved through a smoothing process. A ball bond is then formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region. Yong Chuan Koh holds 1 patent.

Career Highlights

Yong Chuan Koh is currently employed at United Test and Assembly Center Limited, where he continues to innovate in semiconductor technology. His work has contributed to advancements in the efficiency and reliability of semiconductor packages.

Collaborations

Some of his coworkers include Jimmy Siat and Jeffrey Nantes Salamat, who collaborate with him on various projects within the company.

Conclusion

Yong Chuan Koh's innovative work in semiconductor packaging demonstrates his commitment to advancing technology in the electronics industry. His patent reflects a significant step forward in wire bonding processes, showcasing his expertise and dedication to innovation.