The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Oct. 15, 1998
Kian Teng Eng, Singapore, SG;
Kok Chin Fong, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The invention is a method for attaching an electronic component ( ) having Ball Grid Array contacts ( ) to a circuit board contact array ( ) to prevent the solder balls ( ) of the Ball Grid Array from fracturing and distorting during solder reflow when the Ball grid Array contact ( ) is attached to a contact ( ) on a printed circuit board ( ) that has a via ( ) extending at least partially though the printed circuit board ( ). A solder form ( ) is placed over each via ( ) in each contact ( ) of the contact array. The electronic component ( ) that has BGA contacts ( ) is placed over the contact array ( ) such that each ball ( ) of the ball grid array of the electronic component resides on a solder form ( ). The component ( ) and circuit board ( ) is subjected to a solder reflow process to seal the component ( ) to the circuit board ( ). The solder form ( ) at least partially fills the via ( ) preventing the BGA contact ( ) from collapsing into the via ( ).