The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2002
Filed:
Jan. 06, 2000
Applicant:
Inventors:
Kian Teng Eng, Singapore, SG;
Lee Teck Yeow, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract
An integrated circuit package ( ) for vertical attachment as part of a high density module ( ) comprising a carrier ( ) having an opening ( ), routing strips ( ), conduits ( ) and side surface terminals ( ), the side surface terminals ( ) disposed on a side surface ( ), which side surface is common to the carrier ( ) and the integrated circuit package . An adhesive layer ( ), which attaches a silicon chip ( ) to a carrier ( ), wire bonding ( ) electrically connecting the silicon chip ( ) to the routing strips ( ) and potting material ( ) filling the opening ( ), are also disclosed.