Company Filing History:
7 out of 48 
3 out of 69 
1 out of 3 Years Active: 2010-2018
Title: The Innovations of Chuen Khiang Wang
Introduction
Chuen Khiang Wang is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor technology. With a total of 11 patents to his name, Wang has made remarkable advancements in the packaging of semiconductor devices.
Latest Patents
One of Wang's latest patents focuses on semiconductor packages and methods of packaging semiconductor devices. This innovative device includes a carrier substrate with first and second major surfaces. The first surface features a die region and contact pads, while the second surface contains package contacts. The carrier substrate is designed with a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This patterned lead frame facilitates interconnections between the contact pads and package contacts. Additionally, the carrier substrate incorporates a dielectric layer that isolates the conductive traces and via contacts. The device also includes a die mounted on the die region of the first surface, showcasing Wang's expertise in semiconductor packaging.
Career Highlights
Throughout his career, Chuen Khiang Wang has worked with notable companies in the semiconductor industry, including United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has contributed to his extensive knowledge and innovative capabilities in semiconductor technology.
Collaborations
Wang has collaborated with several talented individuals in his field, including Nathapong Suthiwongsunthorn and