The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Oct. 28, 2005
Chuen Khiang Wang, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Sin Nee Song, Singapore, SG;
Steven Yu Feng Yao, Singapore, SG;
Hua Hong Tan, Singapore, SG;
Chuen Khiang Wang, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Sin Nee Song, Singapore, SG;
Steven Yu Feng Yao, Singapore, SG;
Hua Hong Tan, Singapore, SG;
UTAC-United Test and Assembly Test Center Ltd., Singapore, SG;
Abstract
A semiconductor chip package and method of making the same. A first chip unit includes a first substrate and a first IC chip electrically connected to the first substrate. A second chip unit includes a second substrate and a second IC chip electronically connected to the second substrate. An adhesive material is provided on a surface of the first IC chip and the second chip unit is mounted onto the surface of the first chip unit including the adhesive material so that at least a portion of the second structure is encapsulated by the adhesive material, thereby providing some encapsulation in the same step as mounting. The first chip unit and the second chip unit may be separated by a spacer which may also provide an electrical connection.