The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 09, 2005
Chuen Khiang Wang, Singapore, SG;
Hao Liu, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Clifton Teik Lyk Law, Singapore, SG;
Rahamat Bidin, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Chuen Khiang Wang, Singapore, SG;
Hao Liu, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Clifton Teik Lyk Law, Singapore, SG;
Rahamat Bidin, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
United Test and Assembly Center Limited, Singapore, SG;
Abstract
A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.