Company Filing History:
2 out of 48 
1 out of 103 Years Active: 2002-2013
Title: Rahamat Bidin: Innovator in Integrated Circuit Technology
Introduction
Rahamat Bidin is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit technology. With a total of 3 patents to his name, he has made significant advancements that enhance the functionality and efficiency of electronic devices.
Latest Patents
One of his latest patents is for a Subscriber Identity Module (SIM) card. This innovative SIM card features a support carrier with a first and second major surface, including a cavity that extends partially into the carrier from the first major surface. The design allows the SIM card to be flexible enough to bend during insertion or removal from a SIM card holder. Another significant patent is for a multi-die integrated circuit (IC) package and its manufacturing method. This method involves attaching a first die onto a leadframe and applying adhesive to the leads, allowing for the attachment of a second die. The adhesive fills the gaps between the leads, preventing the formation of internal cavities within the package.
Career Highlights
Throughout his career, Rahamat has worked with prominent companies such as United Test and Assembly Center Limited and St Assembly Test Services Inc. His experience in these organizations has contributed to his expertise in the field of integrated circuits.
Collaborations
Rahamat has collaborated with talented individuals, including Hien Boon Tan and Hao Liu, who have contributed to his projects and innovations.
Conclusion
Rahamat Bidin's work in the field of integrated circuits showcases his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic devices, making him a significant figure in the industry.