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Singapore, Singapore

St Assembly Test Services Inc.

USPTO Granted Patents = 103

% Expired Patents = 6.8

Forward Citations = 1,804

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94 inventors (with patents filed for the assignee):

Il Kwon Shim (30 out of 208 patents)

Seng Guan Chow (16 out of 207 patents)

John Briar (16 out of 17 patents)

4. Virgil Cotoco Ararao (13 out of 13 patents)

5. Byung Joon Han (10 out of 63 patents)

6. Raymundo M Camenforte (10 out of 11 patents)

7. Jeffrey David Punzalan (8 out of 70 patents)

8. Kambhampati Ramakrishna (8 out of 31 patents)

9. Jae Hun Ku (7 out of 29 patents)

10. Byung Hoon Ahn (7 out of 12 patents)

11. Chee-Keong Tan (7 out of 7 patents)

12. Jian Jun Li (7 out of 7 patents)

13. Hermes T Apale (6 out of 8 patents)

14. Weddie Pacio Aquien (6 out of 6 patents)

15. Sheila Marie L Alvarez (5 out of 24 patents)

Core Competencies:

Integrated Circuit Package

Heat Spreader

Semiconductor Device

Die Stacking

Thermally Enhanced

Passive Device Integration

Ball Grid Array

Leadframe Assembly

Fabrication Method

Molded Stiffener

CSP Packages

Optoelectronic Devices

103 patents: Sort by Forward Citations

1. 9034693 - Integrated circuit package with open substrate and method of manufacturing thereof (2015-05-19),

2. 8207598 - Semiconductor package heat spreader (2012-06-26),

3. 8035204 - Large die package structures and fabrication method therefor (2011-10-11),

4. 8030783 - Integrated circuit package with open substrate (2011-10-04),

5. 7960816 - Semiconductor package with passive device integration (2011-06-14),

6. 7863730 - Array-molded package heat spreader and fabrication method therefor (2011-01-04),

7. 7786593 - Integrated circuit die with pedestal (2010-08-31),

8. 7700404 - Large die package structures and fabrication method therefor (2010-04-20),

9. 7626277 - Integrated circuit package with open substrate (2009-12-01),

10. 7595551 - Semiconductor package for a large die (2009-09-29),

11. 7575956 - Fabrication method for semiconductor package heat spreaders (2009-08-18),

12. 7446408 - Semiconductor package with heat sink (2008-11-04),

13. 7443039 - System for different bond pads in an integrated circuit package (2008-10-28),

14. 7413933 - Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor (2008-08-19),

15. 7381593 - Method and apparatus for stacked die packaging (2008-06-03),

St Assembly Test Services Inc., headquartered in Singapore, specializes in semiconductor packaging solutions. The company focuses on advanced technologies such as integrated circuit packaging, die stacking, and thermally enhanced designs. Their expertise extends to passive device integration and various assembly techniques, including ball grid array and leadframe assembly. By leveraging innovative approaches in semiconductor device manufacturing, St Assembly Test Services plays a crucial role in enhancing the performance and reliability of electronic components.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

103 Patents

#36 in Singapore

#36 in Singapore

#7,571 in the World

Singapore, Singapore

St Assembly Test Services Inc.

Forward Citations = 1,804

94 inventors:

Il Kwon Shim (30 out of 208 patents)

Seng Guan Chow (16 out of 207 patents)

John Briar (16 out of 17 patents)

4. Virgil Cotoco Ararao (13 out of 13 patents)

5. Byung Joon Han (10 out of 63 patents)

Please report any incorrect information to [email protected]

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