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Singapore, Singapore

St Assembly Test Services Inc.

USPTO Granted Patents = 103

Forward Citations = 1,797

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94 inventors (with patents filed for the assignee):

Il Kwon Shim (30 out of 202 patents)

Seng Guan Chow (16 out of 207 patents)

John Briar (16 out of 17 patents)

4. Virgil Cotoco Ararao (13 out of 13 patents)

5. Byung Joon Han (10 out of 62 patents)

6. Raymundo M Camenforte (10 out of 11 patents)

7. Jeffrey David Punzalan (8 out of 70 patents)

8. Kambhampati Ramakrishna (8 out of 31 patents)

9. Jae Hun Ku (7 out of 29 patents)

10. Byung Hoon Ahn (7 out of 12 patents)

11. Chee-Keong Tan (7 out of 7 patents)

12. Jian Jun Li (7 out of 7 patents)

13. Hermes T Apale (6 out of 8 patents)

14. Weddie Pacio Aquien (6 out of 6 patents)

15. Sheila Marie L Alvarez (5 out of 24 patents)

Core Competencies:

Integrated Circuit Package

Semiconductor Package

Heat Spreader

Die Stacking

Leadframe Assembly

Optoelectronic Devices

Thermally Enhanced Packaging

Flip Chip Technology

Passive Device Integration

Moisture Resistant Packaging

Chip Scale Package

BGA Packages

103 patents: Sort by Forward Citations

1. 9034693 - Integrated circuit package with open substrate and method of manufacturing thereof (2015-05-19),

2. 8207598 - Semiconductor package heat spreader (2012-06-26),

3. 8035204 - Large die package structures and fabrication method therefor (2011-10-11),

4. 8030783 - Integrated circuit package with open substrate (2011-10-04),

5. 7960816 - Semiconductor package with passive device integration (2011-06-14),

6. 7863730 - Array-molded package heat spreader and fabrication method therefor (2011-01-04),

7. 7786593 - Integrated circuit die with pedestal (2010-08-31),

8. 7700404 - Large die package structures and fabrication method therefor (2010-04-20),

9. 7626277 - Integrated circuit package with open substrate (2009-12-01),

10. 7595551 - Semiconductor package for a large die (2009-09-29),

11. 7575956 - Fabrication method for semiconductor package heat spreaders (2009-08-18),

12. 7446408 - Semiconductor package with heat sink (2008-11-04),

13. 7443039 - System for different bond pads in an integrated circuit package (2008-10-28),

14. 7413933 - Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor (2008-08-19),

15. 7381593 - Method and apparatus for stacked die packaging (2008-06-03),

ST Assembly Test Services Inc. is a leading provider of semiconductor assembly and testing services. With over 50 years of experience, we specialize in the design, assembly, and testing of integrated circuits and related components. Our state-of-the-art facilities and advanced technologies enable us to deliver high-quality, cost-effective solutions to our global clients. We offer a wide range of services including wafer probing, package assembly, final testing, and supply chain management. Our commitment to innovation, quality, and customer satisfaction has made us a trusted partner for leading semiconductor companies worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

103 Patents

#36 in Singapore

#36 in Singapore

#7,373 in the World

Singapore, Singapore

St Assembly Test Services Inc.

Forward Citations = 1,797

94 inventors:

Il Kwon Shim (30 out of 202 patents)

Seng Guan Chow (16 out of 207 patents)

John Briar (16 out of 17 patents)

4. Virgil Cotoco Ararao (13 out of 13 patents)

5. Byung Joon Han (10 out of 62 patents)

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