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For the Inventor, By the Inventor

Shrewsbury, MA, United States of America

Hermes T Apale

USPTO Granted Patents = 8

Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 113(Granted Patents)


Location History:

  • Singapore, SG (2004 - 2005)
  • Shrewsbury, MA (US) (2004 - 2023)

Company Filing History:

goldMedal6 out of 103 
 
St Assembly Test Services Inc.
 patents
silverMedal2 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2004-2025

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8 patents (USPTO):Explore Patents
1. 12211778 - Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure (2025-01-28),
2. 11764136 - Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure (2023-09-19),
3. 6960493 - Semiconductor device package (2005-11-01),
4. 6875634 - Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same (2005-04-05),
5. 6825067 - Mold cap anchoring method for molded flex BGA packages (2004-11-30),
6. 6818981 - Heat spreader interconnect for thermally enhanced PBGA packages (2004-11-16),
7. 6737298 - Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same (2004-05-18),
8. 6706563 - Heat spreader interconnect methodology for thermally enhanced PBGA packages (2004-03-16),
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