The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Aug. 09, 2004
Applicants:
Virgil C. Ararao, Atlanta, GA (US);
Hermes T. Apale, Shrewsbury, MA (US);
IL Kwon Shim, Signapore, SG;
Inventors:
Virgil C. Ararao, Atlanta, GA (US);
Hermes T. Apale, Shrewsbury, MA (US);
Il Kwon Shim, Signapore, SG;
Assignee:
ST Assembly Test Services, LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ; H01L021/50 ;
U.S. Cl.
CPC ...
Abstract
An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.