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For the Inventor, By the Inventor

Atlanta, GA, United States of America

Virgil Cotoco Ararao

This inventor holds 13 USPTO granted patents. Top assignee: St Assembly Test Services Inc.. Active years: 2004-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Virgil Cotoco Ararao. Retrieved from https://idiyas.com/inventor/virgil-cotoco-ararao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 92.3

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 195(Granted Patents)


Location History:

  • Singapore, SG (2004 - 2009)
  • Atlanta, GA (US) (2005 - 2011)
  • Shrewsbury, MA (US) (2010 - 2012)

Company Filing History:

goldMedal13 out of 103 
 
St Assembly Test Services Inc.
 patents

Years Active: 2004-2012

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13 patents (USPTO):Explore Patents
1. 8207598 - Semiconductor package heat spreader (2012-06-26),
2. 7863730 - Array-molded package heat spreader and fabrication method therefor (2011-01-04),
3. 7786593 - Integrated circuit die with pedestal (2010-08-31),
4. 7575956 - Fabrication method for semiconductor package heat spreaders (2009-08-18),
5. 7381593 - Method and apparatus for stacked die packaging (2008-06-03),
6. 7327025 - Heat spreader for thermally enhanced semiconductor package (2008-02-05),
7. 7242101 - Integrated circuit die with pedestal (2007-07-10),
8. 7153725 - Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor (2006-12-26),
9. 6960493 - Semiconductor device package (2005-11-01),
10. 6875634 - Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same (2005-04-05),
11. 6825067 - Mold cap anchoring method for molded flex BGA packages (2004-11-30),
12. 6775140 - Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices (2004-08-10),
13. 6737298 - Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same (2004-05-18),

Title: Innovations of Virgil Cotoco Ararao in Semiconductor Technology

Introduction

Virgil Cotoco Ararao is a notable inventor based in Atlanta, GA, known for his significant contributions to semiconductor technology. With a total of 13 patents to his name, Ararao plays a vital role in advancing the efficiency and performance of semiconductor devices.

Latest Patents

Among his most recent innovations are two key patents that enhance semiconductor packaging technologies. The first patent, a **Semiconductor Package Heat Spreader**, features a semiconductor heat spreader formed from a unitary metallic plate. This innovative design includes channel walls that define a channel for receiving a semiconductor, with feet extending from the channel walls for reliable substrate attachment.

The second patent, titled **Array-Molded Package Heat Spreader and Fabrication Method Therefor**, describes a method for creating an array heat spreader consisting of multiple connected panels. Each panel is equipped with slots on opposing sides, and legs that are integral to the panels support the structure, demonstrating a novel approach to heat spreading in semiconductor packages.

Career Highlights

Ararao is currently employed at St Assembly Test Services Inc., where he leverages his expertise in semiconductor technology. His work not only emphasizes innovation but also the practical application of advanced manufacturing processes in the semiconductor industry.

Collaborations

Throughout his career, Ararao has collaborated with talented colleagues such as Il Kwon Shim and Seng Guan Chow. Together, they have contributed to the development of advanced packaging solutions that improve the functionality and thermal management of semiconductor devices.

Conclusion

Virgil Cotoco Ararao's work continues to influence the semiconductor field significantly. His patents reflect a commitment to innovation and excellence, paving the way for future advancements in the technology that underpins modern electronics. With his contributions, Ararao stands as a key figure in the ongoing evolution of semiconductor packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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