The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Jan. 27, 2004
Tie Wang, Singapore, SG;
Virgil Cotoco Ararao, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Sheila Marie L. Alvarez, Singapore, SG;
Tie Wang, Singapore, SG;
Virgil Cotoco Ararao, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Sheila Marie L. Alvarez, Singapore, SG;
ST Assembly Test Services Ltd., Singapore, SG;
Abstract
A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.