Company Filing History:
10 out of 103 
1 out of 80 
Years Active: 2000-2004
Title: Raymundo M Camenforte: Innovator in Semiconductor Testing and Packaging
Introduction
Raymundo M Camenforte is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor testing and packaging. With a total of 11 patents to his name, Camenforte has developed innovative methods and apparatuses that enhance the efficiency and effectiveness of testing small semiconductor devices.
Latest Patents
Camenforte's latest patents include a method for testing BGA (Ball Grid Array) and other CSP (Chip Scale Package) packages using probing techniques. This invention involves a method and apparatus for handling small semiconductor devices during testing. Multiple devices are mounted within a device strip carrier and positioned for testing. The positioning of the device strip carriers is performed using alignment tools, allowing for easy repositioning with respect to the test head or probe card for testing multiple devices contained within the carrier. Another notable patent is for the single unit automated assembly of flex enhanced ball grid array packages. This package is designed for mounting IC (Integrated Circuit) devices, where the IC die is bonded to metal traces in a flexible tape, attached to a stiffener, and solder balls are affixed to another surface of the flexible tape.
Career Highlights
Throughout his career, Camenforte has worked with notable companies such as St Assembly Test Services Inc. and the Institute of Microelectronics. His work in these organizations has allowed him to refine his expertise in semiconductor technology and contribute to advancements in the industry.
Collaborations
Camenforte has collaborated with esteemed colleagues, including John Briar and Rajiv Mehta, further enhancing his innovative projects and expanding his impact in the field.
Conclusion
Raymundo M Camenforte stands out as a key figure in semiconductor innovation, with a strong portfolio of patents that reflect his dedication to improving testing and packaging methods. His contributions continue to influence the industry and pave the way for future advancements.