The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2000
Filed:
Sep. 28, 1998
Raymundo M Camenforte, Singapore, SG;
John Briar, Singapore, SG;
ST Assembly Test Services, Pte Ltd., Singapore, SG;
Abstract
A molded electronic circuit package is described to which stabilizing tape can be attached using automatic or semi-automatic means. The stabilizing tape stabilizes the assembly for further processing operations such as dicing or attachment to a higher level package. The assembly comprises a substrate to which devices are attached. Molded caps are formed over the devices. Molded tape supports are formed at the same time as the molded caps and are located adjacent to opposite sides of the molded cap. The molded tape supports have the same height as the molded cap. The stabilizing tape can then be attached to the tops of the molded tape supports and the molded caps using automatic or semi-automatic means.