The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
Nov. 18, 2005
IL Kwon Shim, Singapore, SG;
Kwee Lan Tan, Singapore, SG;
Jian Jun LI, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Il Kwon Shim, Singapore, SG;
Kwee Lan Tan, Singapore, SG;
Jian Jun Li, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
St Assembly Test Services Ltd., Singapore, SG;
Abstract
An integrated circuit package comprises a substrate including a core layer with a through opening and vias. A first conductive layer is on the core layer covering the through opening and a second conductive layer is on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.