Singapore, Singapore

Jian Jun Li


Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2004-2015

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7 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jian Jun Li

Introduction

Jian Jun Li is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit packaging. With a total of seven patents to his name, he has made remarkable advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

Among his latest patents are two notable inventions: the "Integrated circuit package with open substrate and method of manufacturing thereof" and the "Integrated circuit package with open substrate." Both patents detail a method of manufacturing an integrated circuit package that involves forming a substrate with a core layer, creating vias in the core layer, and applying a conductive layer with a specific thickness. These innovations facilitate connections between an integrated circuit die and the conductive layer, showcasing his expertise in the field.

Career Highlights

Jian Jun Li is currently employed at St Assembly Test Services Inc., where he continues to push the boundaries of technology. His work has not only contributed to the company's success but has also positioned him as a leader in the industry.

Collaborations

Throughout his career, Jian Jun Li has collaborated with talented individuals such as Il Kwon Shim and Kwee Lan Tan. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jian Jun Li's contributions to integrated circuit packaging are invaluable, and his patents reflect his dedication to advancing technology. His work at St Assembly Test Services Inc. and collaborations with esteemed colleagues further highlight his impact in the field.

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