The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Jun. 10, 2004
IL Kwon Shim, Singapore, SG;
Kwee Lan Tan, Singapore, SG;
Jian Jun LI, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Il Kwon Shim, Singapore, SG;
Kwee Lan Tan, Singapore, SG;
Jian Jun Li, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
ST Assembly Test Services Ltd., Singapore, SG;
Abstract
A method for manufacturing an integrated circuit package comprises forming a substrate by forming a core layer with a through opening and vias. A first conductive layer is formed on the core layer covering the through opening and a second conductive layer is formed on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are formed between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.