Singapore, Singapore

Dario S Filoteo, Jr


Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 237(Granted Patents)


Company Filing History:


Years Active: 2005-2016

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27 patents (USPTO):Explore Patents

Title: Spotlight on Innovator Dario S Filoteo, Jr: Leading the Semiconductor Revolution in Singapore

Introduction: Dario S Filoteo, Jr. is an influential inventor based in Singapore, known for his significant contributions to the semiconductor industry. With an impressive portfolio of 27 patents, Filoteo has been instrumental in developing innovative technologies that have advanced electronic devices.

Latest Patents: Among his notable patents are two cutting-edge technologies focused on semiconductor packaging. The first patent details a chip scale module package integrated within a ball grid array (BGA) semiconductor package. This innovative package incorporates a BGA substrate with integrated metal layer circuitry, a flip chip chip scale module package containing the first integrated passive device (IPD), and an application die connected to the IPD. The manufacturing method for this semiconductor package involves providing a BGA substrate with integrated circuitry, attaching the flip chip CSMP, and subsequently linking an application die to the IPD.

The second patent focuses on an integrated circuit package with an open substrate, detailing a method for its production. This involves creating a substrate from core layers, forming vias, and establishing a conductive layer on the core with specific thickness requirements, ultimately connecting an integrated circuit die to the conductive layer.

Career Highlights: Dario S Filoteo, Jr. has made a mark in the industry through his dynamic work with leading companies such as Stats Chippac Pte. Ltd. and St Assembly Test Services Inc. His expertise in semiconductor packaging and design has allowed him to drive forward technological advancements and enhance product performance.

Collaborations: Throughout his career, Filoteo has collaborated with distinguished professionals in the field, including Emmanuel Espiritu and Rachel Layda Abinan. Their combined expertise and innovative mindset have contributed to the development of state-of-the-art semiconductor technologies.

Conclusion: Dario S Filoteo, Jr. exemplifies the spirit of innovation within the semiconductor sector. His 27 patents reflect his commitment to advancing technology, and his collaborations highlight the importance of teamwork in achieving groundbreaking solutions. As he continues to lead the way in semiconductor development, the industry eagerly anticipates his future contributions.

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