The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Mar. 30, 2006
Applicants:
Emmanuel Espiritu, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
Inventors:
Emmanuel Espiritu, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.