IDiyas

For the Inventor, By the Inventor

Singapore, Singapore

Philip Lyndon Cablao

USPTO Granted Patents = 11

Average Co-Inventor Count = 4.2

ph-index = 5

Forward Citations = 102(Granted Patents)


Company Filing History:

goldMedal11 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2008-2013

Loading Chart...
11 patents (USPTO):Explore Patents
1. 8569872 - Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation (2013-10-29),
2. 8421221 - Integrated circuit heat spreader stacking system (2013-04-16),
3. 8395254 - Integrated circuit package system with heatspreader (2013-03-12),
4. 8344495 - Integrated circuit packaging system with interconnect and method of manufacture thereof (2013-01-01),
5. 8304921 - Integrated circuit packaging system with interconnect and method of manufacture thereof (2012-11-06),
6. 8138080 - Integrated circuit package system having interconnect stack and external interconnect (2012-03-20),
7. 8026129 - Stacked integrated circuits package system with passive components (2011-09-27),
8. 7911046 - Integrated circuit packaging system with interposer (2011-03-22),
9. 7759169 - Integrated circuit heat spreader stacking method (2010-07-20),
10. 7518226 - Integrated circuit packaging system with interposer (2009-04-14),
11. 7439620 - Integrated circuit package-in-package system (2008-10-21),

Title: The Innovations of Philip Lyndon Cablao

Introduction

Philip Lyndon Cablao is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit technology. With a total of 11 patents to his name, Cablao has made remarkable advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

Among his latest innovations is the "Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation." This patent describes an integrated circuit package system that includes a die-pad with a predefined slot and an integrated circuit attached to the die-pad. The system connects the integrated circuit to the die-pad with a bond wire and encapsulates both the integrated circuit and the bond wire. Additionally, it features partial saw isolation grooves along a single axis, partitioning the die-pad into a side pad and a die attach pad. Another notable patent is the "Integrated circuit heat spreader stacking system," which includes an integrated circuit on a substrate, a heat spreader with a heat sink dome, and a stacking stand-off for the heat spreader, ensuring efficient thermal management.

Career Highlights

Cablao is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate and develop cutting-edge technologies in the semiconductor industry. His work has significantly impacted the design and manufacturing processes of integrated circuits, making them more efficient and reliable.

Collaborations

Throughout his career, Cablao has collaborated with talented professionals, including Dario S Filoteo, Jr. and Allan Pumatong Ilagan. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Philip Lyndon Cablao's contributions to the field of integrated circuits exemplify the spirit of innovation and creativity. His patents not only reflect his expertise but also pave the way for future advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…