The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Nov. 13, 2009
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Allan P. Ilagan, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Allan P. Ilagan, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.