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For the Inventor, By the Inventor

Singapore, Singapore

Henry Descalzo Bathan

This inventor holds 101 USPTO granted patents and 6 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L24-48). Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henry Descalzo Bathan. Retrieved from https://idiyas.com/inventor/henry-descalzo-bathan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 101 

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 7

Forward Citations = 330(Granted Patents)

Forward Citations (Not Self Cited) = 296(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal101 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2020

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Areas of Expertise:
Integrated Circuit
Packaging System
Flip Chip
Interconnects
Lead Frames
Conductive Bumps
Die Paddles
Protective Coating
Paddle Interlock
Array Contacts
High Lead Count
Wafer Level Integration
101 patents (USPTO):Explore Patents
1. RE47923 - Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps (2020-03-30),
2. 9337161 - Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof (2016-05-10),
3. 9177897 - Integrated circuit packaging system with trace protection layer and method of manufacture thereof (2015-11-03),
4. 9142531 - Integrated circuit packaging system with plated leads and method of manufacture thereof (2015-09-22),
5. 9059151 - Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof (2015-06-16),
6. 9059074 - Integrated circuit package system with planar interconnect (2015-06-16),
7. 9035440 - Integrated circuit packaging system with a lead and method of manufacture thereof (2015-05-19),
8. 9034692 - Integrated circuit packaging system with a flip chip and method of manufacture thereof (2015-05-19),
9. 8981548 - Integrated circuit package system with relief (2015-03-17),
10. 8957515 - Integrated circuit package system with array of external interconnects (2015-02-17),
11. 8941219 - Etched recess package on package system (2015-01-27),
12. 8937393 - Integrated circuit package system with device cavity (2015-01-20),
13. 8936971 - Integrated circuit packaging system with die paddles and method of manufacture thereof (2015-01-20),
14. 8912046 - Integrated circuit packaging system with lead frame and method of manufacture thereof (2014-12-16),
15. 8810017 - Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof (2014-08-19),

Title: Henry Descalzo Bathan: A Pioneer in Semiconductor Innovations

Introduction

Henry Descalzo Bathan is a distinguished inventor based in Singapore, known for his substantial contributions to the semiconductor industry. With an impressive portfolio of 101 patents, Bathan has demonstrated a remarkable commitment to innovation and technology. His work has significantly influenced the way semiconductor devices are designed and manufactured.

Latest Patents

Among Bathan's latest inventions are groundbreaking patents that enhance semiconductor device functionality. One such patent details a semiconductor device and method of forming Package-in-Package (PiP) with an inner known good die interconnected with conductive bumps. This innovation involves a first conductive layer formed over a temporary carrier, creating a conductive bump that supports a first semiconductor die. The addition of encapsulants and a substrate integration process showcases Bathan's intricate approach to semiconductor packaging.

Another notable patent involves an integrated circuit package system featuring a removable backing element with plated terminal leads. The methodology described in this patent outlines the systematic attachment of multiple dies and efficient electrical interconnections, emphasizing Bathan's expertise in modern integrated circuit design.

Career Highlights

Henry Descalzo Bathan has made significant strides in his career, having worked with renowned companies such as Stats Chippac Pte. Ltd. and Stats Chippac Ltd. His tenure at these organizations has provided him invaluable experience and has facilitated the development of numerous innovative semiconductor solutions.

Collaborations

Throughout his career, Bathan has collaborated with notable coworkers including Zigmund Ramirez Camacho and Lionel Chien Hui Tay. These partnerships have fostered a spirit of innovation and have led to the successful realization of many pioneering semiconductor technologies.

Conclusion

Henry Descalzo Bathan's contributions to the semiconductor field illustrate his exceptional talent and dedication as an inventor. With a prolific patent portfolio and a history of collaborative work, Bathan continues to inspire innovation in the industry, paving the path for future advancements in semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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