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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9059074 B1

PDFFull Text
Date of Patent:
Jun. 16, 2015

Filed:

Mar. 26, 2008

Integrated circuit package system with planar interconnect

Applicants:

Zigmund Ramirez Camacho, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Abelardo Jr. Hadap Advincula, Singapore, SG;

Inventors:

Zigmund Ramirez Camacho, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Abelardo Jr. Hadap Advincula, Singapore, SG;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:

Ishimaru & Associates LLP

Primary Examiner:

Galina Yushina

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01);
Abstract

An integrated circuit package system includes: mounting an integrated circuit die adjacent to a lead; forming a first encapsulation around and exposing the integrated circuit die and the lead; and forming a planar interconnect between the integrated circuit die and the lead with the planar interconnect on the first encapsulation.

Find Patent Forward Citations

Camacho, Zigmund. (2015). Integrated circuit package system with planar interconnect (U.S. Patent No. 9059074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9059074

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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